or MIL-STD-866 are reference documents in the solicitation or contract.

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MIL-STD-867C

TABLE III

(Limited Access or Swab Etch Technique)

STEP	PROCESS	SOLUTION	TIME	TEMPERATURE	REMARKS
1.	Solvent clean	Cleaner A-A- 59281 or ASTM- 0329	As necessary	Ambient	Wipe surface with commercial cheese cloth saturated with solvent. Wipe dry with cheese cloth.
2.	Nitric acid etch	Nitric acid (A-A-59105) 4% to 10% (by volume) in alcohol (27CFR 21.35, Formula 3-A)	Until a black smutty etch is produced.	Ambient	Swab the surface with commercial grade cheese cloth saturated with Nitric solution. The more concentrate solution reduces time.
3.	Rinse	Acetone (ASTM-0329)	To remove nitric acid	Ambient	Rinse immediately
4.	Acid clean	Hydrochloric acid (ASTM- E1146) 6% to 10% (by volume) in water	To remove black smut.	Ambient	Swab with commercial cheese cloth saturated with HCL solution.
5.	Rinse	Clean water	To remove HCL	Ambient	Swab with commercial cheese cloth saturated with water.
6.	Neutralize	Any alkali solution with pH of 10 minimum	To neutralize HCL	Ambient	Swab with commercial cheese cloth saturated with alkali solution.
7.	Rinse	Clean water	To remove caustic	Ambient	Swab with commercial cheese cloth saturated with water.
8.	Rinse	Alcohol	To remove water	Ambient	Swab with commercial cheese cloth saturated with alcohol and wipe dry.
9.	Inspect and evaluate per appropriate criteria.
*10.	Oil	Rust preventative MIL-PRF-16173	Swab only	Ambient	To prevent corrosion.
Steps 1 thru 9 shall be completed without interruption.
* Apply the oil after the required embrittlement relief bake. This step may be omitted if the facility can show evidence that corrosion during the queue between process steps is not an issue. This could be the case in a low humidity environment.