MIL-STD-867C
b. Containers used for acid solutions shall be non-reactive to acid and alkali solutions, preferably made of polyethylene or polyvinyl chloride material.
c. Water rinse tanks shall be equipped with a constant overflow or skimming device.
d. The following auxiliary equipment shall be provided:
the workstation.
(1) Clock or timer with second's readout that can be read from
inspection level.
(2) Light capable of insuring 2152.8 Lux (200 foot candles) at
4.1.3 Company process specifications. Company process specifications may be prepared incorporating the applicable requirements of this standard and in addition supplying the detailed information necessary to meet or exceed this standard using the particular equipment, process, personnel and test facilities required to meet the reliability requirements of the product. Personnel training, qualification and certification
procedures shall be documented.
4.1.3.1 Standardization. The company process specification shall reflect procedures and records to assure adequate Quality Assurance measures are being enforced to keep the process in control. Applicable drawings or other documents shall specify the allowable severity and concentration of allowable temper etch conditions through use of photographs or wording as to allowable grinding burn severities by color, size and/or hardness differential. The component or applicable document shall also show:
a. Process name.
b. Process step number and operation name. c. Processing time for each step.
d. Processing temperature for each step. e. Materials used in each processing tank.
4.2 Responsibility for inspection. Unless otherwise specified in the contract or purchase order, the supplier is responsible for the performance of all inspection requirements as specified herein. The supplier may utilize his own facilities or any other commercial laboratory acceptable to the customer.
4.3 Manufacturing process cycle. The temper etch process shall be used after final grinding or machining operations but prior to any processing, which may interfere with this inspection, such as plating or shot peening. The etch process will remove approximately 0.0013 millimeters (0.00005 inch) of material from the surface of the part using the process in TABLE I. Material removal using the process in TABLE II could be
0.0051 millimeters (0.0002 inches) or more. The processor will need to review the
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